How We Build LED Drivers
Five production steps, one inspection gate after each. Every number below is a line we actually run — not a capability we would like to claim.
Towe manufactures LED drivers in a 4,000 m² plant in Zhongshan, Guangdong, with 100 staff and three automated production lines. Components pass incoming inspection, run through SMT and lead-free wave soldering, receive computerised in-circuit test, are assembled into aluminium housings with silicone semi-potting or full potting, then every single unit runs 100% full-load high-temperature aging on ten racks before final test and packing. The line holds a production pass rate above 99% and a field failure rate at or below 0.03%.
From component to carton, in five steps
| Step | What happens | Inspection gate |
|---|---|---|
| 1 · Incoming material | Transformers, capacitors, ICs and housings checked against the approved vendor list before release to the line. | Reel-level traceability, first-article on new lots |
| 2 · SMT + wave solder | Three automated lines run SMT placement and wave soldering; lead-free process throughout for RoHS. | Computerised ICT on every board before assembly |
| 3 · Assembly + potting | Board into extruded or die-cast aluminium housing, then silicone semi-pot or full pot depending on series. | Pot depth and cure checked per batch; hipot on every waterproof unit |
| 4 · 100% full-load aging | Every unit runs at rated power on 10 high-temperature aging racks. No sampling plan, no skipped batches. | Pass rate above 99% at final QC |
| 5 · Final test + packing | Output voltage, load and insulation re-checked, then cartoned with the tested quantity per carton. | 0.03% field failure rate across shipped volume |
Five capabilities, with the limits stated
Each page lists the equipment, the specification, and the cases where a different supplier or process is the better answer.
100% Full-Load Aging Test
Every unit runs full-load high-temperature aging on 10 racks before packing — no sampling. 99%+ pass rate, 0.03% field failure rate.
Equipment and specificationAutomated SMT & Wave Soldering
Three automated LED driver production lines with SMT placement, automatic wave soldering and computerized ICT in-circuit test on every board.
Equipment and specificationIP67 Potting & Sealing
Silicone full-potting and semi-potting encapsulation for LED drivers up to 2000 W, achieving IP67 in all-aluminium housings with integrated cable glands.
Equipment and specificationOEM / ODM Customization
OEM/ODM LED driver customization: custom housings, gift boxes, laser silk-screen marking, terminal options and housing colours on drivers from 7 W to 2000 W.
Equipment and specificationSmart Lighting Integration
Smart LED power supplies with 2.0 MESH networking, compatible with Mi Home, Tmall Genie, Amazon Alexa and Siri. Wiring-free extension and multi-device linkage.
Equipment and specificationThe honest limits
Buyers get burned more often by an undisclosed gap than by a stated one. These are the things to route elsewhere.
No die or mould tooling
Housings are existing extrusions and die-cast profiles. A completely new housing needs a tool, quoted separately with a 25–35 day lead time.
No DALI-2 certification
We build 0–10 V, triac and MESH 2.0 control. A project that specifies DALI-2 certification needs a different platform, and we will say so at quotation.
No sub-zero cold-start guarantee
Standard series are rated for normal ambient. Below −20 °C, ask before ordering — the electrolyte and the potting compound both need a different specification.
Want the production evidence?
Ask for the aging rack log, the ICT yield trend, or a video walkthrough of the line during your order. We send it before you place a deposit, not after.